Branched end layout分支端头布局
Conductors separate toward different ends, creating individual connection points. Branch lengths and directions can follow the equipment modules.导线向不同端头分出，形成独立接入位置。各支路可围绕设备模块分别安排长度与方向。
Low-Pressure Molding低压成型
VIC-3 & U229 Communication Coiled Branch HarnessVIC-3与U229接口 · 通信螺旋分支线束
VIC-3 & U229 Communication Coiled Branch Harness combines branched end layout, coiled or spiral form. Interface, circuit and installation data guide dimensions, material selection and sample review.VIC-3与U229接口 · 通信螺旋分支线束的结构重点包括分支端头布局、卷绕或螺旋形态。接口、电路与安装资料将作为尺寸、物料和样品制作的确认依据。
- Interface and circuit review接口与回路对应审核
- Length and installation configuration线长与安装结构定制
- Manufacture from approved sample样品确认后组织制造
CONSTRUCTION结构解析
Connection structure and design details连接结构与设计要点
Use the vic-3 & u229 communication coiled branch harness form as a starting point and confirm these design points against drawings and the actual equipment.以VIC-3与U229接口 · 通信螺旋分支线束的结构形式为起点，结合图纸和实际设备确认以下设计要点。
Coiled or spiral form卷绕或螺旋形态
The cable is arranged in a coiled or spiral form, with straight tails and ends placed for storage or connection positions.线缆以卷绕或螺旋形态排列，直线尾段与端头可以结合收纳或连接位置安排。
Interface and function review接口与功能确认
Low pressure does not establish harmlessness to every component低压不等于对所有器件无损
CONFIGURATION结构与选配
Construction & customization options结构与定制配置
The table describes the construction and available configuration choices. Materials, dimensions, circuits and inspection requirements are agreed for each project.以下说明展示结构与可配置内容。具体材料、尺寸、电路和检验要求按项目确认。
| Low-pressure molding grade and compatibility低压成型材料牌号与相容性 | Select the exact material grade and check jacket and component compatibility.选择准确材料牌号并核对护套及器件相容性。 |
|---|---|
| Encapsulation boundary, wall thickness and cavity电子件包覆边界、壁厚与腔体 | Define encapsulation boundaries, wall thickness, cavities and protected regions on the drawing.图纸定义包覆边界、壁厚、腔体和需保护区域。 |
| Process temperature, pressure and fill path工艺温度、压力与灌注路径 | Set temperature, pressure and fill paths within component limits.按器件限制确定温度、压力及灌注路径。 |
| Electrical, adhesion, void and environmental checks电气、粘接、空洞与环境检验 | Agree electrical, bonding, void and environmental checks separately.分别约定电气、粘接、空洞与环境检查方法。 |
| Installation and operating boundary安装与使用边界 | Provide the bare insert, component map, keep-out zones, cable and connector interfaces, service environment, coverage boundary, quantity and required verification.请提供裸嵌件、元件地图、禁压区、线缆与连接器接口、使用环境、覆盖边界、数量及所需验证。 |
| Sample and release basis样品与放行依据 | Release records the insert revision, resin identity, material preparation, tooling, process window, critical dimensions and agreed electrical, mechanical and environmental evidence.放行文件记录嵌件版本、树脂身份、材料准备、工装、工艺窗口、关键尺寸与约定的电气、机械及环境证据。 |
APPLICATIONS连接的应用
Application directions应用方向
These are connection directions for project discussion. Suitability depends on interfaces, circuits, installation conditions and project validation; configuration can be adapted to the equipment.以下为可讨论的连接方向。实际适用性取决于接口、电路、安装环境和项目验证，可按设备需求调整。
Equipment control-board connections设备控制板连接
Document pin-row views, mating direction and nearby wire support. Check access to the latch and contacts after assembly. Select the exact material grade and check jacket and component compatibility.板端连接要给出针排视图、插合方向和近端线缆支撑；检查装配后是否仍能操作锁扣并查看接点。选配时，选择准确材料牌号并核对护套及器件相容性。
Branch joining and joint protection分支汇接与接点保护
Define each conductor, stacking direction and joint geometry before selecting tooling, insulation protection and inspection methods. Define encapsulation boundaries, wall thickness, cavities and protected regions on the drawing.分支汇接需定义每根导体、叠放方向和接头几何，再选择工装、绝缘保护与检验方法。选配时，图纸定义包覆边界、壁厚、腔体和需保护区域。
Module wiring within enclosures机箱内部的模块配线
Coordinate board positions, module removal and wire bends within the enclosure. Preserve insulation clearance and support behind each termination. Set temperature, pressure and fill paths within component limits.机箱内部配线需要协调板卡位置、模块拆装和导线转弯空间；端接后的绝缘与支撑不能被外壳挤压。选配时，按器件限制确定温度、压力及灌注路径。
Cable exits and nearby support电缆出口与近端支撑
Keep bending loads away from contacts through appropriate rear support. Review exit angle, retention distance and boot dimensions with the enclosure. Agree electrical, bonding, void and environmental checks separately.端头后方的支撑要避免把弯折载荷直接传到接点，出线角度、固定距离和尾套尺寸需与机壳一起评审。选配时，分别约定电气、粘接、空洞与环境检查方法。
Leads for small electronic modules小型电子模块的引线
Define contact mapping, fine-wire processing limits and enclosure clearance for compact modules. Locate support close to the cable ends. Select the exact material grade and check jacket and component compatibility.小型模块的接口定义需要覆盖针位、细线加工范围和壳内空间，靠近端头的支撑位置尤其重要。选配时，选择准确材料牌号并核对护套及器件相容性。
Contact and fine-wire termination端子与细线端接
Contact selection depends on conductor construction, insulation diameter and tooling limits. Set wire preparation and crimp inspection for the actual contact part. Define encapsulation boundaries, wall thickness, cavities and protected regions on the drawing.端子选择同时取决于导体结构、绝缘外径和工具范围；备线尺寸与压接检查应落到实际接点型号。选配时，图纸定义包覆边界、壁厚、腔体和需保护区域。
ENGINEERING & PRODUCTION工程与制造
Adapt the connection to your equipment.围绕设备，调整连接细节。
Touched by me, better it’ll beTouched by me, better it’ll be
Custom wire harness manufacturing in China中国工厂 · 定制线束制造
Our China factory supports low-pressure molding projects through custom wire harness manufacturing and OEM/ODM development. Interface, circuit and installation data guide material selection, sample builds and manufacturing-document approval before repeat production.Super Smile-Tech 中国工厂围绕低压成型的项目需求提供定制线束制造与 OEM/ODM 支持。我们从接口、电路与安装资料开始，协同物料选配、样品制作和制造文件确认，再按批准要求组织重复生产。
Define termination and protection boundaries确定端接与保护边界
Select the exact material grade and check jacket and component compatibility. Low pressure does not establish harmlessness to every component.选择准确材料牌号并核对护套及器件相容性。 低压不等于对所有器件无损。
Match dimensions and operating motion配合尺寸与使用动作
Define encapsulation boundaries, wall thickness, cavities and protected regions on the drawing. Distinguish repairable and non-repairable encapsulation.图纸定义包覆边界、壁厚、腔体和需保护区域。 包覆结构需区分可维修与不可维修。
Verify processing and finished condition验证工艺与成品状态
Set temperature, pressure and fill paths within component limits. Material-grade data does not replace assembly validation.按器件限制确定温度、压力及灌注路径。 材料牌号资料不能替代组件验证。
PRODUCT QUESTIONS产品问答
Product & customization questions产品与定制常见问题
Is low-pressure molding harmless to every component?低压成型对所有器件都无损吗？
Low pressure does not establish harmlessness to every component. Select the exact material grade and check jacket and component compatibility.低压不等于对所有器件无损。选择准确材料牌号并核对护套及器件相容性。
Can the assembly be serviced after encapsulation?包覆后还能维修吗？
Distinguish repairable and non-repairable encapsulation. Define encapsulation boundaries, wall thickness, cavities and protected regions on the drawing.包覆结构需区分可维修与不可维修。图纸定义包覆边界、壁厚、腔体和需保护区域。
Can material data replace finished-assembly validation?材料资料能替代成品验证吗？
Material-grade data does not replace assembly validation. Set temperature, pressure and fill paths within component limits.材料牌号资料不能替代组件验证。按器件限制确定温度、压力及灌注路径。
Start with your interface and installation requirements从您的接口与安装需求开始
Share mating interfaces, a circuit table, target lengths or a sample for the vic-3 & u229 communication coiled branch harness. We can use them to review configuration and sample requirements.提供VIC-3与U229接口 · 通信螺旋分支线束的对插接口、回路表、目标长度或参考样品，我们据此梳理选配与样品确认事项。