APPLICATIONS连接的应用Application directions应用方向
These are connection directions for project discussion. Suitability depends on interfaces, circuits, installation conditions and project validation; configuration can be adapted to the equipment.以下为可讨论的连接方向。实际适用性取决于接口、电路、安装环境和项目验证,可按设备需求调整。
Relate the marked edge, polarization feature and both end views. Document fixed folds and strain support separately on the assembly drawing. Record conductor spacing, count and individual area separately.排线连接应把标识边、极化缺口和两端针位视图对应起来,固定折弯与拉力支撑在装配图中单列。选配时,分别记录导体间距、芯数及每芯截面。
Define bends, retention points and assembly order in confined spaces. Do not compensate for an incorrect interface direction or length with forced folds. Confirm insulation thickness, total width and marked edge for the exact model.狭小空间布线需明确转弯、固定点和拆装顺序,不能用强行折线弥补接口方向或长度误差。选配时,绝缘厚度、总宽度及标识边按准确型号确认。
Document pin-row views, mating direction and nearby wire support. Check access to the latch and contacts after assembly. Define termination form, connectors and stripping dimensions together.板端连接要给出针排视图、插合方向和近端线缆支撑;检查装配后是否仍能操作锁扣并查看接点。选配时,端接形式、连接器与剥线尺寸成套确定。
Coordinate board positions, module removal and wire bends within the enclosure. Preserve insulation clearance and support behind each termination. Specify radius and duty separately for fixed folds and dynamic bending.机箱内部配线需要协调板卡位置、模块拆装和导线转弯空间;端接后的绝缘与支撑不能被外壳挤压。选配时,固定折弯与动态弯折分别规定半径和使用边界。
Keep latches and cable ends accessible for board service. Review removal paths and cable allowance alongside the controlled pinout. Record conductor spacing, count and individual area separately.板卡检修要保留锁扣与连接端的操作空间,拆装路径和线缆余量应与受控针脚表一起确认。选配时,分别记录导体间距、芯数及每芯截面。
In multi-board equipment, define slots, board orientation and pin mapping at each end. Keep ribbon folds and retention clear of module-removal paths. Confirm insulation thickness, total width and marked edge for the exact model.多板卡设备需要清楚定义插槽、板间方向和各端针位,排线的折返与固定不能妨碍模块抽出。选配时,绝缘厚度、总宽度及标识边按准确型号确认。